Castings for Fast-Growing Tele-Communication Industry
The technology iteration of the communication industry also promotes the continuous development and progress of the die-casting industry. Compared to the traditional tele-communication base station housing, the new generation cases are getting bigger with thinner heat sink fins, which puts forward higher requirements for die-casting equipment.

Application Highlights

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Innovative Product Design

The product structure is getting bigger while the average wall thickness becomes thinner. Some heat sink fins have a height of 80-100mm and a thickness of merely 1mm. The die-casting machines have gradually reached 4500-6000 tons from 1250-2000 tons in the 3G era.

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Innovation Advantages

Compared with other processes, die casting allows you to make larger parts, achieve better thermal conductivity and more complex structure. Near Net Shape of housings larger than 1m with uneven thickness can be completed in one step.

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Core Technology

YIZUMI's high vacuum die-casting technology and local compression technologies enable you to perfectly achieve the forming of ultra-high&thin fins with high thermal conductivity materials, fulfilling the requirements for external vision quality and internal denseness of the product: no porosity, shrinkage and blister.

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Process Technology

Whether you use the traditional die-casting process, high vacuum die-casting process, or semi-solid-casting process, YIZUMI's experienced process engineers can provide you with full support, making your production worry-free.

5G Base Station Housing Application

5G Signal Base

5G Signal Base

Rejector Cover

Rejector Cover

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Relevant Technologies
The Unique Rapid Pump Feeding Technology for LEAP Machine

The Unique Rapid Pump Feeding Technology for LEAP Machine

Patented servo compensation technique results in excellent productivity, energy savings, and precise control of the die-casting machine. This kind of technology could save energy by between 40 and 70%. The primary pump's lifespan is extended using energy compensation technology, which also results in a secondary energy savings of more than 5%.

ORCA Control System

ORCA Control System

Based on Yi-CastMaster functional assistance and multi-touch operation to reduce customer learning costs. The master AI core control algorithm, which is specifically design for die-casting island integrated control. Through visual graphic interface, easier HMI could be achieve.

Yi-Cast Injection System

Yi-Cast Injection System

With AI self-learning function, it could realize full closed-loop real-time control of the pressurized injection to precisely control and monitor the process. Meanwhile, the patented technology of differential pressurized injection could realize slow and precise stable control to enhance the dynamic pressurized injection force.

Highly Integrated Die-Casting Cells

Highly Integrated Die-Casting Cells

It is possible to achieve plug-and-play and rapid adjusting of peripheral devices. HMI smoothly incorporates several types of information from auxiliary equipment. Die-casting process is visible and traceable due to the centralized control of digital island.

Re-designed Clamping System

Re-designed Clamping System

Accurate control of any position mold opening. The repeatability accuracy of the mold opening position is up to ±1mm. It also offers clamping force detection and automatic mold adjustment features.

Service Process

01
Process/Mold Analyse and Design
  • Raw materials selection
  • Product design
  • Mold flow analysis
  • Mold design suggestion
02
Equipment Selection Suggestions
  • Product performance
  • Product quality
  • Ease of use
  • Safety requirements
03
Whole Plant Planning Advice
  • Planning of production line
  • Arrangements for people, machines, and materials according to process flow
  • Peripheral automation
  • Smart connection
04
Delivery Solutions
  • Professional installation and debugging
  • On-site operation training
  • Molding process training
05
After Sales Solutions
  • YFO services
  • Preventive maintenance
  • Device upgrade
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